Packaged microarray apparatus and a method of bonding a microarray into a package

摘要

A method of bonding a microarray to a package uses optional surface treatments on the microarray and on the package to enhance the adhesion of the microarray to the package using an adhesive. The adhesive bonds to the microarray and the package with sufficient bond strength and flexibility to withstand the stress caused by different expansion rates during exposure to temperature extremes. A method of attaching the microarray to the package uses a plurality of adhesives to provide the bond strength and flexibility. A packaged microarray apparatus comprises a microarray of biological features, a package, and an adhesive bond between the microarray and the package. The apparatus may have surface treatment and/or the adhesive bond may comprise a plurality of adhesives.