Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device

摘要

An apparatus for heating and cooling a semiconductor device in a handler for testing the semiconductor device is provided. The apparatus includes: a thermal conductive mounting plate having a plurality of seating recesses on which the semiconductor devices are mounted; a thermal conductive heating plate installed adjacent to a lower side of the mounting plate and having at least one heater installed therein, for transferring heat to the mounting plate; a thermal conductive cooling plate installed adjacent to a lower side of the heating plate on a main body of the handler and having a flow groove such that a cooling fluid fed from an external cooling fluid supply source flows and then is exhausted to an outside; a heating control means for controlling heat irradiated from the heater of the heating plate to control heating temperature of the mounting plate; and a cooling control means for controlling amount of the cooling fluid fed to the cooling plate to control cooling temperature of the mounting plate.