发明名称 |
Method of making a semiconductor package having exposed metal strap |
摘要 |
Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated in an insulative encapsulant, such as molded plastic. A top surface of the strap is exposed to the environment through the encapsulant. The exposed surface may have grooves formed therein, or fins formed thereon, to facilitate heat transfer.
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申请公布号 |
US2003113954(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20030356046 |
申请日期 |
2003.01.31 |
申请人 |
GLENN THOMAS P.;GILLETT BLAKE A. |
发明人 |
GLENN THOMAS P.;GILLETT BLAKE A. |
分类号 |
H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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