| 摘要 |
According to the invention, a semiconductor component, with at least one semiconductor chip (20) on a base chip (10) serving as substrate has contact surfaces (11, 21) made of metal on the at least one semiconductor chip (20) and the base chip (10). The semiconductor chip (20) and the base chip (10) are thus arranged relative to each other such that the corresponding contact surfaces of the at least one semiconductor chip (20) and the base chip (10) are facing each other and the facing contact surfaces (11, 21) are electrically connected to each other. The separation between a contact surface of the at least one semiconductor chip (20) and the corresponding contact surface of the base chip (10) is less than 10 microm. The base chip (10) comprises components produced by a first technique, whilst the at least one semiconductor chip (20) comprises components produced by means of a second technique. |
