| 摘要 |
A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid. In another option, a system includes a chassis including a plurality of electronic components, where the chassis forms a closed system therein. A gas ditribution member is positioned within the chassis, and directs chilled gas toward the electronic components. A gas cooling device cools the gas after the gas has been heated by the electronic components. |
