发明名称 NOZZLE DEVICE, AND SUBSTRATE TREATING APPARATUS HAVING THE DEVICE
摘要 There are provided a nozzle device for forming a treating liquid film of a uniform thickness on a substrate with a small quantity of treating liquid and a substrate treating apparatus having the nozzle device. The nozzle device 10 is provided with a plurality of ejection ports 18 formed in its lower face, a liquid reserving chamber 22 for reserving the treating liquid fed, and liquid ejection passages 23, 17 one ends of which communicate with the ejection ports 18 and the other of which communicate with the liquid reserving chamber 22 to feed the treating liquid reserved in the liquid reserving chamber 22 to the ejection ports 18 and to eject the treating liquid from the ejection ports 18. These ejection ports 18 are arrayed in a plurality of rows in the longitudinal direction of the nozzle device 10 and are so arranged between the ejection ports 18 of the adjoining rows thereof and staggered in the array direction.
申请公布号 WO03049868(A1) 申请公布日期 2003.06.19
申请号 WO2001JP11056 申请日期 2001.12.17
申请人 SUMITOMO PRECISION PRODUCTS CO., LTD.;AKASAKA, TAKESHI;MIZUKAWA, SHIGERU;MURATA, TAKASHI;NAKATA, KATSUTOSHI;MATSUMOTO, SHUNJI 发明人 AKASAKA, TAKESHI;MIZUKAWA, SHIGERU;MURATA, TAKASHI;NAKATA, KATSUTOSHI;MATSUMOTO, SHUNJI
分类号 B08B3/02;B05B1/14;B05B13/04;B05C5/02;B08B3/04;B41J3/407;B65G49/06;G03F7/16;H01L21/00;H01L21/027;H01L21/304;H01L21/306;(IPC1-7):B05B1/14;B05C5/00;B05C11/08 主分类号 B08B3/02
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