发明名称 |
Electronic device and leadframe and methods for producing the electronic device and the leadframe |
摘要 |
The invention relates to an electronic device and a leadframe and to methods for producing the electronic device and the leadframe. The electronic device has a semiconductor chip with a top side fixed on a rewiring plate by a double-sided adhesive film. The underside of the rewiring plate has an edge region with through openings. The through openings are filled with a plastics compound that holds together the semiconductor chip and the rewiring plate by acting as a mechanical clip.
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申请公布号 |
US2003111719(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20020325251 |
申请日期 |
2002.12.19 |
申请人 |
REISS MARTIN;ZACHERL JURGEN |
发明人 |
REISS MARTIN;ZACHERL JURGEN |
分类号 |
H01L23/13;H01L23/31;H01L23/498;(IPC1-7):H01L23/06 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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