发明名称 Flame-retardant epoxy resin composition, molded object thereof, and electronic part
摘要 The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.01 to 70% by weight and in the range of 0 to 70% by weight, respectively, relative to a total quantity of the epoxy resin (A), the phosphazene compound (B) and the epoxy hardener (C), and the inorganic filler (D) is included in the range of 0 to 95% by weight relative to a total quantity of the epoxy resin (A), the phosphazene compound (B), the epoxy hardener (C) and the inorganic filler (D), wherein the phosphazene compound (B) is at least one selected from the group consisting of (1) a cyclic and/or a chain phosphazene compound with a specific structure, (2) a polymer of the cyclic and/or the chain phosphazene compound; and (3) a reaction product of the cyclic and/or the chain phosphazene compound with one type of a compound selected from the group consisting of an epoxy compound, a phenol compound, an amine compound and an acid anhydride.
申请公布号 US2003114606(A1) 申请公布日期 2003.06.19
申请号 US20020221813 申请日期 2002.11.07
申请人 TANIGUCHI MASATOSHI;TADA YUJI;NISHIOKA YOICHI 发明人 TANIGUCHI MASATOSHI;TADA YUJI;NISHIOKA YOICHI
分类号 C08J5/00;C08G59/40;C08G79/02;C08K3/00;C08K5/5353;C08K5/5399;C08L63/00;C08L85/02;H01L23/14;H01L23/29;H01L23/31;H01L23/498;H05K1/03;(IPC1-7):C08G59/14 主分类号 C08J5/00
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