发明名称 |
PLATING APPARATUS, PLATING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
Problem: It has been desired to form a plurality of combinations of plating films continuously on a single transfer rail and to form a plating film having a high quality and a uniform thickness on the surfaces of a lead frame and leads. Solving Means: The plating apparatus is provided below the single transfer rail with a plurality of plating tanks, in which plating solution baths are disposed. By moving the plating solution between the plating tanks and the plating solution baths, it is possible to select a plating film to be formed on a conductive member (21). As a result, it is possible to form combinations of plating films on the conductive member (21) continuously by the single transfer rail.
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申请公布号 |
WO03050328(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
WO2001JP10873 |
申请日期 |
2001.12.12 |
申请人 |
SANYO ELECTRIC CO., LTD.;KAMEYAMA, KOUJIRO |
发明人 |
KAMEYAMA, KOUJIRO |
分类号 |
C25D5/10;C25D7/12;C25D17/00;C25D17/08;C25D17/10;C25D17/28;C25D19/00;C25D21/00;H01L23/495;H01L23/50;(IPC1-7):C25D7/00 |
主分类号 |
C25D5/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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