| 摘要 |
PURPOSE: A multi-chip package is provided to be capable of overcoming the unstability of a bonding wire and the problem of routing by using a dummy chip including a circuit pattern. CONSTITUTION: A plurality of board pads(138) and solder pads are formed on the upper and lower portion of a board(130), respectively. A plurality of chips(111,121,131,141) are stacked on the board using an adhesive, wherein chips have chip pads(117,127,137,147), respectively. A dummy chip(210) having a metal pattern is stacked in the middle of the chips. A plurality of bonding wires(112,122,132,133,142,143) are used for connecting between chips and dummy chip, dummy chip and board, and chips and board. A plurality of solder balls(140) are attached on the lower portion of the board through solder pads. The upper portion of the resultant structure is enclosed with a molding part(160). |
