| 摘要 |
PURPOSE: A method for fabricating a flip chip package is provided to improve the reliability of a semiconductor device by forming a solder bump on a printed circuit board instead of a semiconductor chip. CONSTITUTION: An electrode pad(220) is connected to a solder bump(214) by forming the solder bump on a printed circuit board(216). A process for forming the electrode pad includes a process for forming a protective layer(204) to expose the metal electrode on a semiconductor substrate(200) including a metal electrode, a process for forming a metallic base layer on the entire surface of the semiconductor substrate including the protective layer, and a process for forming a metallic base layer pattern on the metal electrode by patterning the metallic base layer. |
