METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide the technology which can provide a semiconductor device having performances required by a customer in a short time by enabling an easy and flexible change in connections of reinterconnect wirings in WLCSP. CONSTITUTION: In a reinterconnect wiring formation process of WLCSP, at least part of a rewiring 3 for connecting bonding pads 1 of a semiconductor chip and bump pads 2 is formed by photolithography using no photo mask. In this rewiring formation process, standard parts are formed by exposure to light using a mask which is followed by development, while parts which should be consistent with customer's specifications are processed in the order of additional exposure to light using no mask and then additional development in the final stage, which allows an easy change in connections of rewirings, such as connecting 1a and 2d by 3d and connecting 1b and 2c by 3c as shown in figure (a) or connecting 1a and 2c by 3d' and connecting 1b and 2d by 3c' as shown in figure (b).