Verfahren zur Montage einer elektrischen Buchse auf einem Substrat

摘要

A method of mounting a banana-type electrical receptacle (70) on the substrate (170) includes the steps of placing the electrical receptacle (70) over an aperture (172) formed in the substrate (170) with support ribs (98) formed on the outer surface (96) of the receptacle (70) supporting the receptacle over the aperture. A deformable electrical lead (76) extends from a centrally disposed conductive member (74) making an electrical connection with an electrical contact (174) on the substrate (170). The electrical lead (76) is affixed to the electrical contact (174) on the substrate and the receptacle is inserted into the aperture (172) crushing or shearing the support ribs (98) and the deforming the electrical lead (76). Alignment ribs (100) formed on the outer surface of the receptacle (70) have shoulders (110) that contact the substrate (170) for positioning the receptacle in the substrate. The mounting method is compatible with automated soldering processes, such as wave flow soldering.