发明名称 ELECTROSTATIC CHUCK OF ION IMPLANTER
摘要 PURPOSE: An electrostatic chuck of an ion implanter is provided to be capable of semipermanently connecting between a platen and a base and easily replacing with each other by using a mechanical connecting part. CONSTITUTION: A wafer is fixed by an electrostatic chuck(200) in an ion implanter under an ion implanting process. The electrostatic chuck(200) is provided with a base(210), a platen(230) installed on the base(210) for fixedly loading the wafer, and a mechanical connecting part(220) for mechanically fixing the platen(230) on the base(210). The mechanical connecting part further includes a fixing part(222) located at the edge portion of the platen(230) and a connecting bolt(224) for fixing between the fixing part(222) and the base(210). Preferably, a plurality of platens(230) are used.
申请公布号 KR20030047341(A) 申请公布日期 2003.06.18
申请号 KR20010077810 申请日期 2001.12.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HA, DO SEON;HONG, HYEONG SIK;KUEM, GYEONG SU;LEE, TAE WON;YOON, MYEONG SIK
分类号 H01L21/683;(IPC1-7):H01L21/265 主分类号 H01L21/683
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