发明名称 |
ELECTROSTATIC CHUCK OF ION IMPLANTER |
摘要 |
PURPOSE: An electrostatic chuck of an ion implanter is provided to be capable of semipermanently connecting between a platen and a base and easily replacing with each other by using a mechanical connecting part. CONSTITUTION: A wafer is fixed by an electrostatic chuck(200) in an ion implanter under an ion implanting process. The electrostatic chuck(200) is provided with a base(210), a platen(230) installed on the base(210) for fixedly loading the wafer, and a mechanical connecting part(220) for mechanically fixing the platen(230) on the base(210). The mechanical connecting part further includes a fixing part(222) located at the edge portion of the platen(230) and a connecting bolt(224) for fixing between the fixing part(222) and the base(210). Preferably, a plurality of platens(230) are used.
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申请公布号 |
KR20030047341(A) |
申请公布日期 |
2003.06.18 |
申请号 |
KR20010077810 |
申请日期 |
2001.12.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HA, DO SEON;HONG, HYEONG SIK;KUEM, GYEONG SU;LEE, TAE WON;YOON, MYEONG SIK |
分类号 |
H01L21/683;(IPC1-7):H01L21/265 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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