| 摘要 |
<p>PURPOSE: To obtain a thermally conductive silicone composition having high heat- releasing performance. CONSTITUTION: The silicone composition comprises (A) 100 pts.wt. of an organopolysiloxane having in one molecule at least two alkenyl groups and a viscosity of 10-100,000 mm¬2/s at 25°C, (B) an organohydrogenpolysiloxane having in one molecule at least two hydrogen atoms directly bound to a silicon atom in such an amount as to be 0.5-5.0 in the ratio: (total number of the hydrogen atoms directly bound to the silicon atom)/(total number of the alkenyl groups in the component A), (C) low- melting metallic powder 40-250°C in melting temperature and 0.1-100μm in mean particle size, (D) a highly thermally conductive filler 0.1-100μm in mean particle size in such an amount as to be 800-2,200 pts.wt. in the total amount of the components C and D and 0.05-0.9 in the weight ratio: C/(C+D), (E) 0.1-500 ppm, on a platinum basis, of a catalyst selected from the group consisting of platinum and platinum compounds, based on the component A, and (F) 0.001-5 pt(s).wt. of an agent for controlling the activity of the catalyst E.</p> |
