发明名称 |
Heat sink for use with electronic processors have series of metal pins across which air-flow occurs |
摘要 |
The heat sink unit is produced of high thermal conductivity metal and has a base plate [30] in contact with the heat energy generating processor. The heat energy is dissipated through parallel pins [38] that project from the base. Threaded tubes [35] are positioned at each corner and these are used for mounting an axial flow air fan.
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申请公布号 |
DE20306201(U1) |
申请公布日期 |
2003.06.18 |
申请号 |
DE2003206201U |
申请日期 |
2003.04.17 |
申请人 |
CHANG, KUO TA |
发明人 |
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分类号 |
H01L23/367;H01L23/467;(IPC1-7):G06F1/16;G06F1/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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