Production of a semiconductor component comprises forming semiconductor wafer containing a semiconductor layer and semiconductor element layer, polishing the wafer and etching whilst the edge of the wafer is masked from the etching medium

摘要

Production of a semiconductor component comprises: (i) forming a semiconductor wafer (I) containing a semiconductor layer (200) and a semiconductor element layer (2); (ii) polishing the wafer up to a pre-determined thickness; and (iii) etching the wafer whilst the edge of the wafer is masked from the etching medium to form an envelope on the edge. Preferred Features: The wafer is etched whilst one region within the edge is partially masked to form a cross-piece in the region. The roughness of one surface after etching is controlled based on the composition of the etching medium used during etching.