| 摘要 |
PURPOSE: A method and apparatus for manufacturing and inspecting a semiconductor device are provided to be capable of preventing the deformation of a bonding wire when carrying out a resin injecting process, for considerably improving productivity and reliability. CONSTITUTION: A mold set-up process is carried out at a frame assembly made of a frame having a lead stay(8), a stage(6), and a semiconductor chip loaded at the upper portion of the stage, for forming a mold unit(10). A chip fixing process is carried out by pressing the semiconductor chip by using at least one chip fixing part(13) capable of being inserted/extracted into/from a cavity portion(12) of the mold unit. Then, a resin filling process is carried out at the resultant structure for completely filling the cavity portion. |
