| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to be capable of simplifying manufacturing processes and easily stacking a plurality of semiconductor chips by improving the structure of the semiconductor package using an anisotropic conductive film. CONSTITUTION: The first chip assembly(10) is located in a hole or groove of a substrate(50) made of a PCB(Printed Circuit Board). The second chip assembly(11) is located on the upper portion of the substrate(50), wherein the second chip assembly is electrically connected with the substrate. The first and second chip assembly are provided with the first and second chip(10a,11a), the first and second metal pad(10b,11b) formed on the circuit surfaces of the first and second chip, conductive bumps(4) attached on the metal pads, and anisotropic conductive films(3) attached on the circuit surfaces of the chips including the conductive bumps, respectively. |
