Light emitting semiconductor component, uses conductive adhesive material for joining semiconductor body electrically and thermally to carrier

摘要

A light emitting diode semiconductor component, has a semiconductor body (12) containing an active layer structure (14) and electrical contacts (16-18) for current injection into the active layer structure (14). A carrier (20) functioning as a heat sink is provided for the semiconductor body (12), the latter being joined electrically and thermally to the carrier by a conductive adhesive (32,34). The side (13) of the semiconductor body facing the carrier (20) has recesses (22) in which a part (34) of the conductive adhesive (32,34) is received between the semiconductor body (12) and the carrier (20).