| 摘要 |
<p>PURPOSE: To obtain a semiconductor package in which sufficient bonding strength is attained while preventing a die bond material from projecting. CONSTITUTION: A plurality of recesses 11a are formed in one side of a semiconductor chip 11 and a die pad part 14 for mounting the semiconductor chip fixedly is provided in a package 12. The die pad part 14 has a part 14a for mounting the semiconductor chip, and a part 14c on the periphery of the mounting part provided with a level difference 14b wherein the semiconductor chip 11 is bonded fixedly to the mounting part 14a on the recess 11a side. Furthermore, a groove part 141 may be formed at the mounting part 14a.</p> |
