Etching device used for etching precision surfaces in the semiconductor industry comprises a reaction chamber for receiving and processing a single object

摘要

Etching device comprises a reaction chamber (1) for receiving and processing a single object. An Independent claim is also included for a process for etching precision surfaces by individually adding different etching agents and introducing in a combination. Preferred Features: The reaction chamber can be closed on its upper side by a locking lid (2) having an observation window. The reaction chamber has a feed (4) and a run-off (5) for the etching agent. The feed consists of a connection (7) joined to the outer side of wall of the reaction chamber.