| 摘要 |
PURPOSE: An optical semiconductor device package structure and a fabricating method therefor are provided to improve the radiative performance of an optical semiconductor device by using a base plate having thermal conductive holes and a plurality of thermal conductive layers. CONSTITUTION: An optical semiconductor device package structure(30) includes a substrate(31), a sidewall portion formed on an edge of the substrate, and a conductive pad(36) for connecting an optical semiconductor device with the outside. The substrate includes a base plate(32) including alumina as the chief ingredient and plural thermal conductive holes and one or more thermal conductive layers. The thermal conductive layers are formed on an upper portion or a lower portion of the base plate. The thermal conductive layers are formed with the first thermal conductive layer(41a41b,41c), the second thermal conductive layer(42a,42b), and the third thermal conductive layer(43a,43b). |
