发明名称 Method and apparatus for removing heat from a plate
摘要 A cooling system (10) includes a member (26A, 26B) with an opening (27) therethrough, and includes first and second heat-conductive sections (21, 22) disposed adjacent the member on opposite sides thereof. A fluid supply section (41) is disposed on a side of the first section opposite from the member, and directs a flow of fluid (111-114) toward the first section. A portion (111, 114) of the fluid flows through the first section, and a different portion (112, 113) of the fluid flows through the other section.
申请公布号 US6578625(B1) 申请公布日期 2003.06.17
申请号 US20020094176 申请日期 2002.03.08
申请人 RAYTHEON COMPANY 发明人 WYATT WILLIAM GERALD;GILSTRAP JEFFREY A.;SCHWARTZ GARY J.
分类号 H01L23/467;H01L23/473;(IPC1-7):H05K7/20 主分类号 H01L23/467
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