发明名称 APPARATUS FOR BUNDLING WIRE MATERIAL TO COIL
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for bundling a wire to a coil so as not to bring about a scuff mark in the case of naturally dropping the wire. SOLUTION: The apparatus for bundling the wire to the coil comprises a cylindrical guide cone 1, a mandrel 2 disposed concentrically with the cone 1, and a plurality of receivers provided at the bottom of the cone 1. The apparatus further comprises a plurality of rotary shafts 4 disposed horizontally at the periphery of the bottom of the cone 1, a plurality of receivers 3 respectively mounted at the bases of the shafts 4 and rotatably provided in a vertical plane, an air cylinder 5 for rotating a plurality of receives 3 in the vertical plane between a holding position for receiving the wire stored in the cone 1 and a retracting position for naturally dropping the wire stored in the cone 1, and an universal joint 7 for coupling the respective shafts 4 to each other. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003170221(A) 申请公布日期 2003.06.17
申请号 JP20010370799 申请日期 2001.12.05
申请人 SUMITOMO HEAVY IND LTD 发明人 UEDA AKIRA
分类号 B21C47/32;B21C47/02;B21C47/24;(IPC1-7):B21C47/32 主分类号 B21C47/32
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