Guiding device for guiding conducting wire soldered on printed circuit board

摘要

A guiding device is provided for guiding a conducting wire extended out from an electronic device to be soldered on a printed circuit board. The guiding device includes a base for supporting and fixing the conducting wire thereon, a first offset board connected to one end of the base for forming a space with an extending portion of the conducting wire when the conducting wire is fixed on the base and a second offset board connected to the other end of the base, which has a hole in a connection portion thereof for preventing the heat from being conducted to the printed circuit board when the conducting wire is soldered on the printed circuit board.