发明名称 |
Apparatus and methods for handling semiconductor wafers |
摘要 |
Disclosed are apparatus and methods used for handling semiconductor wafers or similar articles. In particular, the apparatus disclosed is capable of flexibly gripping items of various shapes and sizes in a manner that substantially reduces or eliminates the likelihood of damage thereto. The apparatus is particularly suited to being used as a robotic end effector for handling wafers using edge-gripping techniques.
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申请公布号 |
US6578893(B2) |
申请公布日期 |
2003.06.17 |
申请号 |
US20010968364 |
申请日期 |
2001.10.01 |
申请人 |
AJS AUTOMATION, INC. |
发明人 |
SOUCY ALAN J.;CASTANTINI JAMES S. |
分类号 |
H01L21/687;(IPC1-7):B25J15/12 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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