| 发明名称 |
Mechanical resistance of a single-crystal silicon wafer |
| 摘要 |
The present invention relates to a method of thinning of a single-crystal silicon wafer so that the wafer has a final thickness lower than 80 mum.
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| 申请公布号 |
US6580151(B2) |
申请公布日期 |
2003.06.17 |
| 申请号 |
US19980173206 |
申请日期 |
1998.10.15 |
| 申请人 |
STMICROELECTRONICS S.A. |
发明人 |
VANDEPUTTE JACQUES;BOURDET FLORINE |
| 分类号 |
H01L21/304;C30B33/00;H01L21/02;H01L29/02;(IPC1-7):H01L29/06 |
主分类号 |
H01L21/304 |
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