发明名称 DUPLEX POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To improve working precision without deforming a lower surface plate. <P>SOLUTION: This duplex polishing device 1 which polish both surfaces of a work 3 by rotating the work in a state of holding it between an upper surface plate 4 and the lower surface plate 5 with pressure is made its upper surface of a lower surface plate receiver part 5 to support the lower surface plate 5 in a flat plate shape. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003170350(A) 申请公布日期 2003.06.17
申请号 JP20010368975 申请日期 2001.12.03
申请人 U T K SYST:KK 发明人 HARADA MASAO;UZAWA AKIHIKO
分类号 B24B37/12 主分类号 B24B37/12
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