发明名称 SUBSTRATE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To decompose organic solvent without using extra equipment, which is contained in the waste liquid discharged from a substrate treatment. SOLUTION: A substrate treating part 10 is provided with first and second substrate treating units 1, 2. The substrate is washed by using purified water and the washed substrate is dried by using the vapor of IPA as the organic solvent in the unit 2. The vapor of IPA is mixed in the purified water in a treating tank 21 and the IPA-mixed waste liquid is discharged through discharge lines 4b, 4c. Ozonized water (an IPA decomposing agent) is supplied to the line 4c from an ozonized water supplying source 72 of this substrate treating apparatus 100 and hydrochloric acid (an IPA auxiliary decomposing agent) is also supplied to the line 4c from a hydrochloric acid supplying source 73 so that the IPA in the waste liquid is decomposed into harmless substances. Since the treatment is carried out in the apparatus 100, IPA decomposing equipment as one of factory facilities is not necessary. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003170182(A) 申请公布日期 2003.06.17
申请号 JP20010374097 申请日期 2001.12.07
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NAGAMI SOZO;SHIRAKAWA HAJIME
分类号 G02F1/13;C02F1/78;G02F1/1333;H01L21/304;(IPC1-7):C02F1/78;G02F1/133 主分类号 G02F1/13
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