| 摘要 |
This invention provides a method and apparatus for opening a resin-sealed body with which, when performing failure analysis and the like of a predetermined circuit including an integrated circuit, movement of an upper aluminum interconnection is prevented and excessive drilling and removal are prevented. In order to open a sample obtained by sealing, with a resin (1), an integrated circuit (2) covered with a polyimide layer (7), while observing a drilling state in enlargement with a stereomicroscope (15), the sealing resin (1) is drilled by the depth of a gold ball (4), is partially drilled by laser irradiation, and is dipped in a beaker (70) which stores a liquid (8) that does not dissolve the polyimide layer (7) and to which ultrasonic vibration is applied.
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