发明名称 SEALING GLASS MATERIAL FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a sealing material which increases strength in a sealed part to mechanical stress on low melding point glass located at the sealed part, and to thermal impact on the sealed part caused by a series of process of heating-dissolution-cooling to be applied on dissolution of the low melting point glass, and reduces brittleness. SOLUTION: As a whiskerlike reinforcing material to be added to low melting point glass as a material for sealing, highly elastic glass fibers or metals such as calcium carbonate and zinc oxide having a material diameter of 0.1 to 5μm and a material length of 10 to 50μm, are mixed in 15 to 50 wt.%. The mixed acicular whiskers play a roll as a reinforcing material at the inside of the low melting point glass, and increases the rigidity of the low melting point glass to mechanical stress on electronic parts, and to strain of a vessel caused by thermal impact to solve the problems. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003171145(A) 申请公布日期 2003.06.17
申请号 JP20010366031 申请日期 2001.11.30
申请人 KINSEKI LTD 发明人 SANO MAKOTO
分类号 C03C14/00;H01L23/10;(IPC1-7):C03C14/00 主分类号 C03C14/00
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