发明名称
摘要 An LSI package including an area for mounting an LSI device thereon and a plurality of lines for connecting the LSI device and external terminals. At least two of the plurality of lines, in which differential signals are transmitted and are adjacent to each other in the LSI package, have equal lengths.
申请公布号 JP3417808(B2) 申请公布日期 2003.06.16
申请号 JP19970228548 申请日期 1997.08.25
申请人 发明人
分类号 H01L23/12;H01L23/498;H01L23/64 主分类号 H01L23/12
代理机构 代理人
主权项
地址