| 发明名称 |
A CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING A SUBSTRATE |
| 摘要 |
A carrier head (100b) for a chemical mechanical polishing apparatus includes a flexible membrane (118b) with an expandable mechanical polishing. The lip portion can form or break a seal with the substrate in response to pressure changes in a chamber (190) in the carrier head. <IMAGE>
|
| 申请公布号 |
SG96551(A1) |
申请公布日期 |
2003.06.16 |
| 申请号 |
SG20000002270 |
申请日期 |
2000.04.22 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HUNG CHEN;STEVEN ZUNIGA |
| 分类号 |
B24B37/00;B24B37/04;B24B37/30;B24B41/06;H01L21/304;(IPC1-7):H01L21/302;H01L21/00;B24B1/00;B24B47/22 |
主分类号 |
B24B37/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
