发明名称
摘要 <p>Through holes are preformed in a ceramic sheet to form recessed portions at corners or side ends of a package 2 used for a solid-state image device. The package is positioned by allowing projections 52, 53 , and 54 of a positioning jig 51 to come into contact with end faces 5 and 6 in the recessed portions along their shapes. The accuracy in combining a solid-state image element and a lens block is improved by using a method of positioning a package in which burrs caused when the package is produced by dividing a ceramic baked product do not affect the accuracy.</p>
申请公布号 JP3416580(B2) 申请公布日期 2003.06.16
申请号 JP19990199603 申请日期 1999.07.13
申请人 发明人
分类号 H01L21/00;H01L23/04;H01L27/14;H01L27/15;H01L31/12;H04N5/335;H04N5/361;(IPC1-7):H01L27/14 主分类号 H01L21/00
代理机构 代理人
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