| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for cutting a lead electrode of a semiconductor device, which can improve lead electrode length precision and sufficiently meet the recent requirements for a shorter lead electrode. SOLUTION: This apparatus cuts a lead electrode of a semiconductor device 11 such as IC, and includes a die 15 and a punch 13. It also has a cutting die 10 for cutting a lead electrode 12 of a semiconductor device 11 into a predetermined length. The die 15 is made slidable in the horizontal direction. Further, in addition to its original role of cutting the lead electrode, the die 15 plays an role of a positioning mechanism (guide), which is made slidable in the horizontal direction and positions the semiconductor device 11 in the horizontal direction based on the position of a resin mold portion of the semiconductor device 11. COPYRIGHT: (C)2003,JPO
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