| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an adhesive material from flowing out from an adhered area of an electronic component in a conductive path along the conductive path at the time of fixing the electronic component to the conductive path of a semiconductor package. <P>SOLUTION: A resin-sealed semiconductor device is provided with a semiconductor chip (10), a plurality of the conductive paths (12) connected to the semiconductor chip through a conductive line (11) extended from the chip, and the electronic component (13) disposed between the two conductive paths and electrically connected to the respective conductive paths through a conductive adhesive material showing fluidity before hardened and resin-sealed integrally with the semiconductor chip. The conductive path is provided with a raised part (15) preventing the adhesive material from flowing out in a longitudinal direction of the conductive path along the conductive path before it is hardened. <P>COPYRIGHT: (C)2003,JPO |
