| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in manufacturability and solder mounting property. <P>SOLUTION: The semiconductor device is provided with a leadless package structure equipped with a substrate 11, a semiconductor chip 14 mounted on the substrate 11 and an electrode 13 formed on the substrate 11 and connected to the semiconductor chip 14 while the semiconductor device is equipped with recesses 16, formed on the side surface of the substrate 11 and recessed from the rear surface of the substrate to a depth not reaching the surface of the substrate to expose at least one part of the electrode 13, and metallic pieces 17, formed on the exposed parts of the electrodes 13 in the recesses 16 so as to have a thickness not reaching the side surface of the substrate 11. <P>COPYRIGHT: (C)2003,JPO |
