发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in stability of the operation without enlarging the area of a cell. <P>SOLUTION: A first conductivity first well is formed in the area of one part of the surface layer for a semiconductor substrate. An MOS transistor is formed in the first well. The MOS transistor comprises a gate insulation film, a gate electrode as well as a first and second impurities diffusion areas at both sides of the gate electrode. A high leak current structure, in which a leak current density upon impressing a bias in the reverse direction of the first impurities diffusion area and the first well becomes larger than the leak current density upon impressing the bias of the same voltage in the reverse direction of the second impurities diffusion area and the first well, is formed. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003168746(A) 申请公布日期 2003.06.13
申请号 JP20010367068 申请日期 2001.11.30
申请人 FUJITSU LTD 发明人 SANBONSUGI YASUHIRO;OTA HIROYUKI;SUGAYA SHINJI;MOMIYAMA YOICHI
分类号 H01L27/06;H01L21/8234;H01L21/8238;H01L21/8244;H01L27/04;H01L27/092;H01L27/11 主分类号 H01L27/06
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