METHOD OF FORMING ELECTRONIC CIRCUIT, WIRING BOARD, ITS MANUFACTURING METHOD, MULTICHIP MODULE, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method by which a multichip module that is provided with high-density wiring having excellent electrical characteristics and is molded with a molding resin can be formed. SOLUTION: In this method the wiring having excellent electrical characteristics is formed by forming wiring composed of an electroplated copper film and an electroplated nickel film on Cr/Cu, on which signal passing wiring joined to solder is formed by sputtering by using Cr/Cu/Cr wiring formed at a portion for grounding by sputtering. In the manufacturing process of the wiring, the wiring can be formed efficiently by using a long thin stainless substrate, because the substrate can be taken up in a roll. COPYRIGHT: (C)2003,JPO