METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide technology for increasing the manufacturing yield of a collectively molded package by preventing the generation of voids on its appearance. SOLUTION: A region of a resist 6 on a substrate 2 below the entire outer circumference or at least either one side of the outer circumference of a collectively molded sealing resin 9, or a region below the air vent 11 of a molding die is removed by a specified width. Since the region serves as an air vent or a convenient resin reservoir, voids are not trapped easily thus preventing the generation of voids on its appearance. COPYRIGHT: (C)2003,JPO