| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cleaning a wafer for inexpensively and sufficiently removing impurities such as polymer, particles, and resist residue existing on a wafer surface without any deformation of the surface shape of the wafer such as enlargement in the opening diameter of a contact hole. SOLUTION: Cleaning liquid LQ such as demineralized water and an inorganic- or organic-based treatment chemical liquid is mixed with pressurized gas GS, a minute droplet SP of cleaning liquid is generated by being jetted from a two-fluid nozzle NZ, and the minute droplet of the cleaning liquid is sprayed to a wafer. In addition to a cleaning effect by normal cleaning liquid, impurities on the wafer surface can be physically removed by the minute droplet. COPYRIGHT: (C)2003,JPO
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