| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-treating apparatus and a substrate-treating method that can treat a hydrophobic wafer by using a fluid-mixing nozzle. SOLUTION: The substrate-treating apparatus comprises a treatment liquid supply means 66 for supplying treatment liquid, an inert gas supply means 67 for supplying an inert gas, and a fluid-mixing nozzle 65 for mixing the inert gas with the treatment liquid for discharging to a substrate, and treats the substrate by the treatment liquid. In this case, the inert gas supply means 67 has a liquid-mixing means 97b for mixing fluid IPA for reducing the surface tension of the treatment liquid with the inert gas. COPYRIGHT: (C)2003,JPO
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