| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device, capable of accurately putting chips in a shell, preventing an offset phenomenon upon closing a cover of the shell, and radiating heat generated upon testing, and a shell for use in the method. SOLUTION: In this manufacturing method for the semiconductor device for manufacturing KGD chips such as a memory and a microcomputer logic and shipping the same, in a process of packing chips into the shell, when the shell is loaded with chips cut from a wafer and individually separated from each other, the chips are held by a holding means and put in the shell under high-accuracy position recognition by a position recognizing means on the device side (step S21), with the chips put in the shell and held to be fixed by the holding means, a body cover of the shell is closed (step S22), further a heat radiation cover formed by a heat radiative member as a part of the cover is closed, and the radiative member of the radiating cover is brought into contact with the chips put in the shell (step S23). COPYRIGHT: (C)2003,JPO
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