| 摘要 |
PROBLEM TO BE SOLVED: To enlarge the occupied area a heat absorption layer by enlarging a fill factor rate without lowering the strength of a diaphragm, and resultantly to increase sensitivity and enlarge an output signal. SOLUTION: This element is equipped with a silicon substrate 2 having a recessed part 8, the diaphragm 3 made of an insulating material, for roughly coating an opening of the recessed part 8 of the substrate 2, and an infrared detection part 4 positioned on the diaphragm 3. A projection part 9 comprising a heat-conductive body for supporting the diaphragm 3 separately from the silicon substrate 2 is provided on the silicon substrate 2. COPYRIGHT: (C)2003,JPO
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