| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer attitude aligning device equipped with a rotating body which rotates a wafer as it holds the wafer by suction, which is capable of keeping a sucked state by shutting off a suction path even if a sucking means is stopped because it sucks up the wafer, keeping airtightness and restraining the wafer from being deformed when it sucks up the wafer. SOLUTION: A wafer attitude aligning device is composed of an annular groove 44 provided to a rotating body 41, O rings 45 and 46 which are different from each other in diameter, brought into contact with the bottom of the annular groove 44, and protrude partially from the annular groove 44, a suction opening 47 opened at the bottom of the annular groove 44, suction paths 48a, 48b, and 48c which are provided inside the rotating body 41 so as to communicate with the suction opening 47, and a suction means which is connected to the suction paths 48a, 48b, and 48c. COPYRIGHT: (C)2003,JPO |
