| 发明名称 |
POLYIMIDE AND PRECURSOR THEREOF, PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING PATTERN |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide and a precursor thereof having both good i-line transmittance and a low thermal expansibility after imidation, to provide a photosensitive resin composition capable of forming a pattern having excellent heat resistance, and to provide a method for producing a pattern. <P>SOLUTION: The polyimide precursor is characterized by containing repeating structural units of formula (1), (2), (3) or (4) wherein R<SB>1</SB>and R<SB>2</SB>are each H or a monovalent organic group; R<SB>3</SB>-R<SB>10</SB>are each H or a hydrocarbon group but at least one of R<SB>3</SB>-R<SB>10</SB>is a hydrocarbon group; R<SB>11</SB>-R<SB>18</SB>are each H or an F-containing group but at least one of R<SB>11</SB>-R<SB>18</SB>is an F-containing group; and X is any of carbonyl, sulfoxide and sulfone bonds. <P>COPYRIGHT: (C)2003,JPO |
| 申请公布号 |
JP2003167344(A) |
申请公布日期 |
2003.06.13 |
| 申请号 |
JP20010366255 |
申请日期 |
2001.11.30 |
| 申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
SASAKI HAN;TAGUSARI TOSHINORI;UEDA ATSUSHI;YAMAZAKI NORIYUKI;KO MASAHIKO;SASAKI AKIHIRO;MIYASAKA MASAHIRO |
| 分类号 |
G03F7/038;C08G73/10;H01L21/027;H01L21/312;H05K1/03 |
主分类号 |
G03F7/038 |
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