| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of taking out substrate by which the abnormally placed state and strain of a carrier and the abnormally driven state of a detecting device can be detected and a substrate can be held normally by means of a take-out and housing arm. SOLUTION: This method of taking out substrate includes a standard mapping step of detecting the position of each standard substrate housed in each standard slot made in a standard carrier by deciding or detecting the thickness and pitch of the standard substrate, and a substrate-to-be-treated mapping step of detecting the thickness, pitch, and position of a substrate to be treated housed in each slot made in a carrier. This method also includes a comparing and discriminating step of comparing the thickness and pitch of each standard substrate decided or detected in the standard mapping step with the thickness, pitch, and position of the substrate to be treated detected in the substrate-to-be- treated mapping step, and discriminating the taking-out of a substrate to be treated in accordance with the results of the comparison. COPYRIGHT: (C)2003,JPO |
