| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which impedance of a lead is not influenced by the material of a substrate to be mounted, and signal transmission loss due to sealing resin can be reduced. <P>SOLUTION: A semiconductor chip 1, a signal lead 3 connected to a signal electrode 1a of the semiconductor chip, an external electrode 4 for signal whereto a signal lead is connected and a ground lead 6 extended along a signal lead are sealed with sealing resin 9. The external electrode 4 for signal is formed as a projection electrode projecting from the bottom of the sealing resin 9. One side of the signal lead 3 is exposed from the bottom of the sealing resin 9. <P>COPYRIGHT: (C)2003,JPO |
