| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a heat treatment of resist capable of preventing resticking of a component evaporated from a resist to the resist. <P>SOLUTION: A resist is heat-treated using the heat treatment equipment with a substrate holder 8 that holds a photomask substrate 2 and a scan heater 1 that is disposed above the photomask substrate 2, heats the substrate 2 and comprises a first heater 6 that heats a part of the substrate 2, an air supply slit 3 for ejecting gas toward the surface of the substrate 2 opposite to the first heater 6 and an air suction slit 4 for sucking gas on the substrate 2. <P>COPYRIGHT: (C)2003,JPO |
